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BD1603NUV
Datasheet
● Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating Conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse Connection of Power Supply Connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply
terminal.
(4) Power Supply Line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Furthermore,
for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same
time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND Voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short Circuit between Terminals and Erroneous Mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in Strong Electromagnetic Field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with Set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input Terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground Wiring Pattern
In terms of GND wiring, the recommended writing is to make single-point grounding at a reference point on the set PCB.
As for GND of external parts as well, please hold PCB design so that impedance may lower fully.
(11) External Capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal Shutdown Circuit (TSD)
When a junction temperature rises above the setting value, the thermal shutdown circuit is activated to turn off the switch.
The purpose of the thermal shutdown circuit is to block LSI when an uncontrolled operation takes place for a temperature
above the setting value. The thermal shutdown circuit has not been engineered to protect or assure LSI. For this reason,
don’t use this circuit to enable continuous use or operation of LSI.
(13) Thermal Design
Thermal design must have enough margins, considering an allowable loss (Pd) in actual usage.
(14) About the Rush Current
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width
of ground wiring, and routing of wiring.
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
10/12
TSZ02201-0G3G0C200040-1-2
17.Dec.2012 Rev.001
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